Sony has promised the end of thermal paste which would normally be used to help distribute heat from the central processor.
Sony has presented a prototype of a carbon sheet which has the aim of replacing thermal paste which is not easy to spread, place and clean.
With this carbon sheet that is from 0.3 to 2 millimetres thick that simply needs to be placed between the processor and heat sink, it will be possible to get heat dispersion that is at least the equivalent of thermal paste. According to tests, the difference between the two options is now more than 3 degrees.
Presented at the Techno-Frontier 2012 show in Tokyo, Japan, this carbon sheet is still only a prototype and has now commercial release date scheduled. But since it replaces another version of a thermal heat dispersion technology while being 5 to 6 times smaller, we can only imagine that this promising product will quickly be distributed on a large scale.
The demonstration of the technology during the Sony Techno-Frontier 2012 show (click to enlarge)